Dr. Robert Andosca

Director Worldwide Applications Technology, Advanced Energy Industries, Inc.

United States

Overcoming manufacturing challenges of large to small area display technology


Over the last two decades of display technology – e.g. flat panel displays (FPD) including organic light emitting diode (OLED) displays – requirements have continued to increase in complexity and manufacturing capabilities. Increasing display resolution (pixel density) is driving a much higher sensitivity to any defects, while increasing substrate size (such as generation 10.5 glass, which is 3meters x 3meters) is pushing the boundaries of manufacturing uniformity. These requirements must be met while reducing the overall cost per substrate demanded in today’s market, creating a huge set of obstacles for manufacturers to overcome. These obstacles directly push the limits of conventional magnetron sputtering and have driven innovation to overcome the emerging process challenges. The obstacles include deposition thickness uniformity over very large areas, particle sensitivity, optical property uniformity, and heat sensitivity, to mention just a few. Many of these issues continue to plague display manufacturers, especially with the ever-increasing use of glass and polymer-based displays, and the growing size and pixel density. This talk will summarize these process challenges, how each occur, and discuss the many different mitigation techniques developed by plasma-based process power system equipment manufacturers to minimize and eliminate the yield detractors. These techniques include, but are not limited to, arc suppression and mitigation using unipolar pulsed DC and bipolar pulsed DC power sources with highly customizable pulse profiles, reverse voltages, synchronization and duty cycle control. Envisioned future industry trends will be discussed as well.


Director, Worldwide Applications Technology, Advanced Energy Industries Inc.
Dr. Robert Andosca (www.linkedin.com/in/randosca) is the Director, Worldwide Applications Technology focusing on plasma-based deposition and etch of thin films materials for Advanced Energy (www.advancedenergy.com) headquartered in Fort Collins, CO. He has 25+ years’ experience in the semiconductor, microelectromechanical systems (MEMS) and photovoltaic industries.

Dr. Andosca's professional experience ranges from C-level to operational to engineering management, business development, and has been a scientist and engineer focusing on many thin film based products. Dr. Andosca is the founder and former CEO of MicroGen Systems (www.microgensystems.com), has held senior level positions at the Smart System Technology & Commercialization Center, Lilliputian Systems, Umicore, Corning IntelliSense, Clare, Lockheed Martin and Irvine Sensors, and is an adjunct professor in the Rochester Institute of Technology’s Mechanical Engineering (www.rit.edu/kgcoe/mechanical) Department.

Dr. Andosca completed his Ph.D. from The University of Vermont (www.uvm.edu) in Materials Science (multi-disciplinary program between EE, ME and Physics). His dissertation research was on theoretical and experimental studies of piezoelectric MEMS-based vibration energy harvester devices and sensors. He also holds an M.S. in Materials Science from UVM, and B.S. degrees in Mathematics and Physics from Keene State College. He is an author on twelve (12) published scientific papers, and is an inventor on twenty-five (25) issued US and international patents and has another eleven (11) pending. Dr. Andosca has been an invited speaker worldwide on Internet of Things, energy harvesting and various thin film technologies.